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Advice re performance of AMD heatsink & thermal paste

Discussion in 'Hardware' started by riffraff9, Feb 4, 2005.

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  1. riffraff9

    riffraff9 Thread Starter

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    Hi.....

    Can anyone assit with the following points.....

    I am awaiting delivery of a AMD 64 3000+ (S939) boxed version that comes with a heatsink and fan. The computer will not be overclocked and the case will have 2 80cm fans mounted in it.

    What is the views around the the performance of the AMD supplied heatsink and fan. Will it do a reasonable job of keeping the CPU cool and be 'reasonably' quiet? If not is there a decent heatsink that can be recommended for a reasonable price. It wiil not have to deal with an overclocked CPU.

    Secondly in relation to thermal paste. Regardless of what heatsink is used, is it best to remove any pads and use thermal paste or keep the pads?

    If thermal paste is used, am I right in saying a small smount is applied to the centre of the heatspreader on the CPU, left as a small mound (as opposed to spreding it out) and none is applied to the heatsink?

    Thanks
     
  2. kiwiguy

    kiwiguy

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    The principle of thermal paste is to give a good thermal transfer between the 2 surfaces.

    It needs to be no thicker than required to do this, and as long as this is understood, how it is applied is actually immaterial. Two mating surfaces requires only a small amount. More is not any better.

    The paste is electrically conductive, so excess paste can cause serious problems if it flows outside the die area, if the CPU chip has SMD's on the upper surface.

    In a stock situation the pad should give adequate transfer, after all it is supplied by the maker of the chip. Admittedly mainly for reasons of making the process idiot proof,
     
  3. riffraff9

    riffraff9 Thread Starter

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    So no need to spread it about then?
     
  4. kiwiguy

    kiwiguy

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    It should be a thin film over the CPU die area only. It should enable a thermal bond over the entire CPU die, to the corresponding area of the heatsink.

    It's not rocket science.
     
  5. crjdriver

    crjdriver Moderator

    Joined:
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    OK, with the 939 pin chip it is a little different. This chip uses a heat spreader over the die. The thermal compound is not applied to the processor die; it is applied to the heat spreader and then only to the center of the heat spreader.

    The hsf that comes with the amd chips are fine. I am using one right now and the temp is 34C running general apps like firefox, outlook, etc.

    The hsf will come with a pad on the fan. I remove the pad and use Artic Silver. Do be advised that while this does a better job of heat transfer, it also can void your warranty [as will using a non amd approved hsf]

    AS has instructions on how to apply their product on their web site. If you elect to use the standard thermal pad, you just put it on after removing the protective tape.
     
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