Of all the weird things I would do in my life. Something made me read the composition information about two different thermal pastes that are available at a local retailer here.
Both of them are "Arctic Cooling" products. One of them is composed of:
10% Silver / Copper
40% Silicon
30% Metal Oxide
20% Carbon
The second one is composed of:
25% Silver
30% Silicon
30% Metal Oxide
15% Carbon
Getting to the point of my questions. Between these two Thermal pastes when used with a P4 3.0GHz processor which would be more effective. And what key features of these products should one use to decide which would be best suited for P4 processors and beyond.
Both of them are "Arctic Cooling" products. One of them is composed of:
10% Silver / Copper
40% Silicon
30% Metal Oxide
20% Carbon
The second one is composed of:
25% Silver
30% Silicon
30% Metal Oxide
15% Carbon
Getting to the point of my questions. Between these two Thermal pastes when used with a P4 3.0GHz processor which would be more effective. And what key features of these products should one use to decide which would be best suited for P4 processors and beyond.